Smart power integration is at the crossroads of different fields of electronics such as high and low power, engine control and electrothermal studies of devices and circuits. These circuits are complex and are heavily influenced by substrate coupling, especially where 3D integration is concerned.
This book provides an overview of smart power integration, including high voltage devices, dedicated and compatible processes, as well as isolation techniques. Two types of integration are highlighted: modular or hybrid integration, together with compatible devices such as the insulated gate bipolar transistor (IGBT); and monolithic integration, specifically through the paradigm of functional integration.
Smart Power Integration outlines the main MOS devices for high voltage integrated circuits, and explores into the fields of codesign, coupling hardware and software design, including applications to motor control. Studies focusing on heat pipes for electronics cooling are also outlined.
1. Overview of Smart Power Integration.
2. Modular or Hybrid Integration.
3. Monolithic Integration.
4. Technology for Simulating Power Integrated Systems.
5. 3D Electrothermal Integration.
6. Substrate Coupling in Smart Power Integration.
Mohamed Abouelatta is a professor of microelectronics at Ain Shams University, Egypt. His fields of research include power devices, smart power ICs, photovoltaic and 3D heterogeneous integration.
Ahmed Shaker is a professor of engineering physics at Ain Shams University, Egypt. His fields of research include power devices, and photovoltaic and tunneling FETs.
Christian Gontrand is a professor at INL/INSA Lyon, France. He was formerly a head professor in the Smart Power Integration team at AMPERE lab and had the technical charge of the CIMIRLY from 1988 to 1996.
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